Login
Welcome:
Guest
Guest
Search for:
Browse:
Product Information:
Resources:
Home > Soldering & Surface Mount Technology > Table of contents:Volume 20 issue 1
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
Content: Latest Issue | 
Latest Issue RSS | Previous Issues
Options: To add Favourites and Table of Contents Alerts please take a Emerald profile
Table of contents:
Volume 20 issue 1
Published: 2008, Start page: p4Icon key: 
You have access to this item 
Backfiles 
Earlycite 
Abstract only
You have access to this item Backfiles Earlycite Abstract only | Article Id: | Article Information: |
|---|---|
| 1711322 | Effect of strain on whisker growth in matte tin A.R. Southworth, C.E. Ho, A. Lee, K.N. Subramanian (pp. 4 - 7) Keywords: Coatings, Electronic engineering, Strain measurement Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (521kb) ] | Reprints & permissions |
| 1711323 | Effect of interconnection area on shear strength of sintered joint with nano-silver paste Kun Qi, Xu Chen, Guo-Quan Lu (pp. 8 - 12) Keywords: Shear strength, Sintering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (223kb) ] | Reprints & permissions |
| 1711324 | Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigue Andreas R. Fix, Wolfgang Nüchter, Jürgen Wilde (pp. 13 - 21) Keywords: Ageing (materials), Diffusion, Solder, Soldering, Thermal testing, Vibration Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (440kb) ] | Reprints & permissions |
| 1711325 | Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn- R.S. Lai, K.L. Lin, B. Salam (pp. 22 - 26) Keywords: Silver, Soldering, Solders, Time Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (432kb) ] | Reprints & permissions |
New products
Further Information
..
|
|
