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Home > Soldering & Surface Mount Technology > Table of contents:Volume 20 issue 3
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 20 issue 3
Published: 2008, Start page: p4Icon key: 
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You have access to this item Backfiles Earlycite Abstract only | Article Id: | Article Information: |
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| 1732897 | The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths Ju Guo-kui, Wei Xi-cheng, Sun Peng, Liu Johan (pp. 4 - 10) Keywords: Joining processes, Solders, Surface mount technology, Tensile strength Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (243kb) ] | Reprints & permissions |
| 1732898 | Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assembly O. Nousiainen, T. Kangasvieri, R. Rautioaho, J. Vähäkangas (pp. 11 - 17) Keywords: Alloys, Fatigue, Head, Solders, Thermal measurement Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (405kb) ] | Reprints & permissions |
| 1732899 | Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs Meng-Kuang Huang, Chiapyng Lee (pp. 18 - 25) Keywords: Failure modes and effects analysis, Lead, Solders Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (240kb) ] | Reprints & permissions |
| 1732900 | A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environment Christopher M. Greene, Krishnaswami Srihari (pp. 26 - 33) Keywords: Alloys, Lead, Lead-free solder paste, Solder paste, Solders Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (220kb) ] | Reprints & permissions |
| 1732901 | Solder paste characterisation: towards the development of quality control (QC) tool R. Durairaj, S. Mallik, N.N. Ekere (pp. 34 - 40) Keywords: Creep, Flux, Quality control, Rheology, Solder paste, Viscosity Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (184kb) ] | Reprints & permissions |
| 1732902 | Silver thick film pastes for low temperature co-fired ceramics: impact of glass frit variation Jayashri Bangali, Sunit Rane, Girish Phatak, Shashikala Gangal (pp. 41 - 46) Keywords: Adhesion, Films (states of matter), Pastes, Sheets, Silver, Surface conductivity Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (220kb) ] | Reprints & permissions |
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