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Home > Soldering & Surface Mount Technology > Table of contents:Volume 24 issue 3
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 24 issue 3
Published: 2012, Start page: p151Icon key: 
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| 17041890 | Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part II – conceptual design of soldering and desoldering system Necdet Geren, Çagdas Sarigül, Melih Bayramoglu (pp. 151 - 166) Keywords: Automated PCBA rework, Design, Flexible manufacturing, FMS design, Printed circuit rework, Printed-circuit boards, Remanufacturing cell, Rework machine, Soldering, Soldering tools, Surface mount rework, Systematic design methodology Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (344kb) ] | Reprints & permissions |
| 17041891 | Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling method Chun-Sean Lau, M.Z. Abdullah, F. Che Ani (pp. 167 - 182) Keywords: Assembly, Computational fluid dynamics, Computer software, Finite-element method, Flow, Forced-convection reflows, Heat transfer, Heat-transfer coefficient, Thermal-coupling method Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (1383kb) ] | Reprints & permissions |
| 17041892 | Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H2 plasmas for flip-chip bumping: the effects of H2 flow rates Y.S. Lin, W.J. Lin, L.Y. Chiu (pp. 183 - 190) Keywords: Ar-H2 plasmas, Copper, Flip chip bumping, Flow, Lead-free solder, Solder, Surface energy, Surface properties of materials, Wettability Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (186kb) ] | Reprints & permissions |
| 17041893 | Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air atmosphere Wei Liu, Yanhong Tian, Lei Yang, Chunqing Wang, Lining Sun (pp. 191 - 196) Keywords: Atmosphere, AuSn4, Gold, Intermetallics, Joining processes, Laser soldering, Micro-solder joints, N2 atmosphere, Reflow, Soldering, Tin Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (346kb) ] | Reprints & permissions |
| 17041894 | The effect of micro via-in pad designs on surface-mount assembly defects: part I – tombstoning Yong-Won Lee, Keun-Soo Kim, Katsuaki Suganuma (pp. 197 - 205) Keywords: Assembly, Lead-free solder, Micro via-in pad, Microprocessor chips, Soldering, Surface-mount technology, Tombstoning Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (444kb) ] | Reprints & permissions |
| 17041895 | Mechanical durability of RFID chip joints assembled on flexible substrates Kamil Janeczek, Tomasz Serzysko, Malgorzata Jakubowska, Grazyna Koziol, Anna Mlozniak (pp. 206 - 215) Keywords: Additives, Carbon nanotubes, Chip assembly, CNT, Flexible substrate, Joining processes, Mechanical durability, Mechanical properties of materials, RFID, Stress (materials) Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (367kb) ] | Reprints & permissions |
| 17041896 | The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process Li-li Gao, Song-bai Xue, Hong Zhu (pp. 216 - 222) Keywords: Alloys, Interfacial microstructure, Praseodymium, Shear strength, Shear strength, SnAgCu solder, Solder, Undercooling Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (329kb) ] | Reprints & permissions |
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